Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
Specifications
| Color | White |
| Model NO. | RAY-Curing |
| Application | PCB Metallographic |
| Customization | Available |
| Bonding Function | Liquid Sealing Leak |
Description
Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin. Fast Curing Time: Curing time ranges from 13 to 15 minutes for efficient workflow. Specialized PCB Application: Suitable for PCB, semiconductor, and micro-electronic metallographic analysis. Acrylic Composition: Consists of 1kg acrylic powder and 800ml liquid hardener. Room Temperature Curing: Classified as room curing material requiring no external heat. Weatherability: Features natural polymer composition with weather-resistant properties. Full Customization: Offers full customization, minor customization, and flexible options. OEM and ODM Services: Provides both OEM and ODM services for tailored manufacturing needs. ISO9001 Certified: Manufacturer holds ISO9001:2015 management system certification.
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Metallographic Cold Mounting Resin Metallurgical Cold Mounting Laboratory Used Metallographic Experiment
