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Metallographic Cold Mounting Resin Metallurgical Cold Mounting Laboratory Used Metallographic Experiment
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Metallographic Cold Mounting Resin Metallurgical Cold Mounting Laboratory Used Metallographic Experiment

4.0InStock Auditedby Dongguan Dinglu Electronic Technology Co., Ltd.
3,758≈ $45 · indicative, confirm with supplier
Payment
T/T
Incoterms
FOB, CIF, EXW

Specifications

ColorWhite
Model NO.RAY-RESIN
ApplicationPCB Metallographic
CustomizationAvailable
Bonding FunctionLiquid Sealing Leak

Description

Metallographic Cold Mounting Resin Metallurgical Cold Mounting Laboratory Used Metallographic Experiment. Specialized for PCB: Ideal for PCB, semiconductor, and micro-electronic metallographic experiments. Fast Curing Time: Complete curing in 13-15 minutes for efficient workflow. Precise Proportion: Requires a 1:0.8 ratio of acrylic powder to liquid hardener. Inorganic Composition: Made of inorganic materials in a water emulsion form. Weatherable Material: Features natural polymer characteristics with high weatherability. Customization Options: Supports full, minor, and flexible customization from samples or designs. Flexible Shipping: Options include air, sea, or customer-requested shipping methods. 100% Quality Inspection: Finished products undergo visual and functional inspection.

Dongguan Dinglu Electronic Technology Co., Ltd.
Guangdong, ChinaManufacturer/Factory & Trading CompanyEst. 2015
Audited supplier
Verified license
29 staff
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