Metallographic Cold Buried Resin Liquid and Powder
Specifications
| Color | White |
| Model NO. | RAY-Curing |
| Application | PCB Metallographic |
| Customization | Available |
| Bonding Function | Liquid Sealing Leak |
Description
Metallographic Cold Buried Resin Liquid and Powder. Fast Curing Time: Curing time is 13-15 minutes for efficient workflow. Precise Proportion: Mix ratio is 1:0.8 between acrylic powder and liquid hardener. Specialized Application: Suitable for PCB, semi-conductor, and micro-electronic metallography. Inorganic Composition: Made of inorganic materials in water emulsion morphology. Customization Options: Supports customization from samples, designs, and flexible adjustments. Quality Assurance: 100% inspection including visual and function checks for finished products. Flexible Shipping: Options include air express for samples and sea freight for large quantities. Manufacturer Direct: Direct supply from a high-tech enterprise with 10 years export experience.