72g 50% Woodpulp Dust-Free SMT Wipe Paper Using in Semiconductor Assembly

Specifications

Description

72g 50% Woodpulp Dust-Free SMT Wipe Paper Using in Semiconductor Assembly. Low Dust & High Solubility: Made of wood pulp and polyester via spunlace process, ensuring low dust and high water solubility. Surface Safe Cleaning: Soft material prevents scratches or damage to sensitive surfaces during cleaning operations. High Tension Uniformity: Features uniform net formation with excellent vertical and horizontal tension for consistent performance. SMT Production Efficiency: Effectively removes residual solder paste and adhesives from SMT printer steel meshes, reducing scrap rates. Multi-Industry Application: Suitable for SMT lines, semiconductor assembly, optical products, PCB, automotive, and medical equipment. Flexible Customization: Offers flexible customization options including minor, full customization, and design/sample-based production. Fast Lead Time: Average lead time is within 15 workdays for both peak and off-season periods. Strict Quality Control: Low cation/anion content and limited particle counts ensure high purity for sensitive electronic assembly.