Ceramic Capillary for 0.025mm Alloy Wire Bonding
4.0InStock Auditedby Shenzhen Silver Technologies Ltd
₹334≈ $4 · indicative, confirm with supplier
Payment
T/T
Incoterms
FOB
Specifications
| Material | Zirconia Ceramics |
| Model NO. | 0.025mm |
| Application | Wire Bonding |
| Application 1 | Can Be Used for Controllable Silicon |
| Customization | Available |
Description
Ceramic Capillary for 0.025mm Alloy Wire Bonding. High Dimensional Accuracy: Zirconia ceramic material ensures precise dimensions for reliable wire bonding. Wide Application Scope: Suitable for LED, IC chips, discrete devices, SAW, and transistor packaging. Good Insulation Performance: Zirconia ceramics provide excellent electrical insulation for semiconductor tools. Custom Design Available: We offer custom designs to meet specific customer packaging requirements. Comprehensive Tool Range: Includes Die Attach, Vacuum Pick Up, Flip Chip, and Wire Bonding Capillaries. Fast Lead Time: Average lead time is within 15 workdays for both peak and off-season.
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